https://github.com/danieltyukov/tue-bep
TUE / BEP - Development and Characterization of a Gold-Bump Flip-Chip Bonding Process for RF IC Applications
https://github.com/danieltyukov/tue-bep
de-embedding flip-chip flip-chip-bonding integrated-circuits interposer lumped-modeling radio-frequency rf thermosonic-bonding yield-characterization
Last synced: 4 days ago
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TUE / BEP - Development and Characterization of a Gold-Bump Flip-Chip Bonding Process for RF IC Applications
- Host: GitHub
- URL: https://github.com/danieltyukov/tue-bep
- Owner: danieltyukov
- License: mit
- Created: 2025-04-13T15:06:09.000Z (over 1 year ago)
- Default Branch: master
- Last Pushed: 2026-07-18T17:56:36.000Z (6 days ago)
- Last Synced: 2026-07-18T19:25:41.195Z (6 days ago)
- Topics: de-embedding, flip-chip, flip-chip-bonding, integrated-circuits, interposer, lumped-modeling, radio-frequency, rf, thermosonic-bonding, yield-characterization
- Language: TeX
- Homepage: https://ieeexplore.ieee.org/document/11293724
- Size: 337 MB
- Stars: 1
- Watchers: 1
- Forks: 0
- Open Issues: 0
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Metadata Files:
- Readme: README.md
- License: LICENSE